Fluxcored solder shall be either composition sn60 or sn63. Ipc jstd 006, requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications. Jstd006 requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications published by ipc on july 1, 20 this standard prescribes the. Ansijstd005 requirements for soldering pastes ansijstd006 requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications. January 1, 1995 requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications this standard prescribes the requirements and test. The ipcjstd002e standard also includes a test method for the resistance to dissolutiondewetting of metallization. Kester solder wire meets ipc specifications jstd006c amendment 1. Hot solder dip meets the tinning requirements of ansiipc jstd001e, class 3, and. Solder wire 6337 tinlead, ipc,ansijstd 006 and astm b32 standards.
Ipc jstd006c prescribes the nomenclature, requirements and test methods for electronic grade. For standards issued by another organization, even if approved by. This standard outlines a process to classify and label a nonsemiconductor components process sensitivity level psl and moisture sensitivity level msl consistent with the semiconductor. Ipc jstd006c requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications developed by the solder alloy task group 524c of the. Ansijstd004 requirements for soldering fluxes ansijstd005 requirements for soldering pastes ansijstd006 requirements for electronic grade solder alloys and fluxed and. Joint industry standard requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications 4th interim final ansi jstd 006. This document provides guidance for manufacturers and. Ncsmq90 solder paste 97640 a4 r8 indium corporation.
Jstd006c requirements for electronic grade solder alloys. Ipc jstd006, requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications. Jstd006b standard jstd006b pdf standard 2112018 standard for commercial building energy audits ansi approvedacca cosponsored. Joint industry standard solderability tests for printed boards 1st working draft ansi jstd 003 april 1992 in d u s t r e s est. Peter, take a look at ipcansi jstd001a and b, jstd004 and i think, 005006 which cover solder paste. Ipceca jstd002 complete document revision d, march 14. It is available as solid wire or flux cored wire in a wide variety of diameters and.
With the increase in the value of metals used in solder alloys, there are several new small. Once you have joined our webinar, you will see this. Ansijstd006 requirements for electronic grade solder. It is also designed for use on microminiature connectors having a, amend angles. Ansiipc jstd004b requirements for soldering fluxesipc jstd006b requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders. Kester bar solder, ultra low dross, sn63 pb37, 123 lb. Since its first edition in 1994, the 607 standard has grown increasingly comprehensive and useful for grounding and bonding. Order reprints ipca610 and ipcjstd001 are widely believed to ensure high reliability of electronic assemblies. Ipc jstd002e solderability tests for component leads, terminations, lugs, terminals and wires. Ipc j std 006c requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications developed by the solder alloy task group 524c of the assembly and joining committee 520 of ipc users of this standard are encouraged to participate in the development of future revisions. Ipc jstd006c requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications. Shop for 0463370030 kester bar solder, ultra low dross, sn63 pb37, 123 lb. A newly released version of a standard that has come a long way.
List of available ansi american national standards institute standards. The jstd006cam1 amendment provides better detail of a solder alloys maximum allowed deviation about the nominal level of the elements mass than was provided in past alloy. Flux classification part 1 interpretation of jstd001 and jstd004 regarding fluxes. Ipc jstd006 requirements for electronic grade solder. By karl seelig, vice president technology and tim oneill, technical marketing manager before rejecting a flux, be sure you understand the standard. Jstd006b wamendment 1 october 2008 jstd006b january 2006 amendment 1 june 2008 jstd006a may 2001 jstd006 january 1995 amendment 1 july 1996. Jstd006b standard jstd006b pdf standard 2112018 standard for commercial building energy audits ansi approvedacca cosponsored standard 90. Ipc jstd006c requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications ipc on. Ipc jstd006c requirements for electronic grade solder. This part is designed to terminate a single 26, 28 or 30 awg wire. This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys. Solder alloys used for solder dip are in accordance with jstd006. Download ansi, american national standards institute, standards ansi is a private, notforprofit, membership organization that acts not as a standards developer, but as a standards coordinating and. The composition of the solder, including contamination levels, shall.
Jstd001f requirements for soldered electrical and electronic assemblies redline comparison of revision e to f this comparison is primarily to show technical changes, deletions and additions. Joint industry standard requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications 4th interim final ansi jstd 006 january 1995 i n d u s t r e s est. Download ansi, american national standards institute. Ipceiajstd006 archives document centers standards forum. Ansijstd004 requirements for soldering fluxes ansijstd006 requirements for electronic grade solder alloys and fluxed and non. Ansiipc jstd004b requirements for soldering fluxesansiipc jstd005 requirements for soldering pastes, includes amendment 1 2007ansiipc jstd004a. Free ipc standards and amendments for download for printed circuit board. Requirements for electronic grade solder alloys and. Kays puretronix wire solder is extruded and manufactured using state of the art extruding and wire drawing processes. Requirements for electronic grade solder alloys and fluxed.